Line-to-ground capacitance calculation for VLSI: a comparison

نویسنده

  • Erich Barke
چکیده

A comparison is made between various approximations of the line-to-ground capacitance problem in a VLSI environment. It is shown that with up-to-date dimensions, the simple parallel-plate model is no longer adequate. However, easy-to-use and fast-to-compute formulas exist that result in accurate and reliable capacitance values. The parasitic capacitance problem is three-dimensional by nature. Three-dimensional calculations, however, are very expensive and thus seem to be an inadequate approach for VLSI. With sufficient accuracy the problem can be reduced to a set of two-dimensional ones. Capacitive couplings are described by three different components [l]:

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Measurement of Line-to-Ground Capacitance in Distribution Network Considering Magnetizing Impedance’s Frequency Characteristic

Signal injection method (SIM) is widely applied to the insulation parameters’ measurement in distribution network for its convenience and safety. It can be divided into two kinds of patterns: injecting a specific frequency signal or several frequencies’ groups, and scanning frequency in a scheduled frequency scope. In order to avoid the disadvantages in related researches, improved signal injec...

متن کامل

Comprehensive Evaluation of Crosstalk and Delay Profiles in VLSI Interconnect Structures with Partially Coupled Lines

In this paper, we present a methodology to explore and evaluate the crosstalk noise and the profile of its variations, and the delay of interconnects through investigation of two groups of interconnect structures in nano scale VLSI circuits. The interconnect structures in the first group are considered to be partially coupled identical lines. In this case, by choosing proper values for differen...

متن کامل

Fast and accurate quasi-three-dimensional capacitance determination of multilayer VLSI interconnects

A new fast and accurate capacitance determination methodology for intricate multilayer VLSI interconnects is presented. Since a multilayer interconnect structure is too complicated to be directly tractable, it is simplified by investigating charge distributions within the system. The quasi-three-dimensional (3-D) capacitances of the structure are then determined by combining a set of solid-grou...

متن کامل

Effective On-chip Inductance Modeling for Multiple Signal Lines and Application on Repeater Insertion

A new approach to handle the inductance effect on multiple signal lines is presented. The worst case switching pattern is first identijied. Then a numerical approach is used to model the effective loop inductance (Leg) for multiple lines. Based on look-up table for Leg, an equivalent single line model can be generated to decouple a specific signal line from the others to per$orm static timing a...

متن کامل

Second-Order Polynomial Expressions for On-Chip Interconnect Capacitance

Simple closed-form expressions for efficiently calculating on-chip interconnect capacitances are presented. The formulas are expressed with second-order polynomial functions which do not include exponential functions. The runtime of the proposed formulas is about 2–10 times faster than those of existing formulas. The root mean square (RMS) errors of the proposed formulas are within 1.5%, 1.3%, ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • IEEE Trans. on CAD of Integrated Circuits and Systems

دوره 7  شماره 

صفحات  -

تاریخ انتشار 1988